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PCA9518
Expandable 5-channel I2C-bus hub
Rev. 05 -- 2 December 2008 Product data sheet
1. General description
The PCA9518 is a BiCMOS integrated circuit intended for application in I2C-bus and SMBus systems. While retaining all the operating modes and features of the I2C-bus system, it permits extension of the I2C-bus by buffering both the data (SDA) and the clock (SCL) lines, thus enabling virtually an unlimited number of buses of 400 pF. The I2C-bus capacitance limit of 400 pF restricts the number of devices and bus length. Using the PCA9518 enables the system designer to divide the bus into an unlimited number of segments off of a hub where any segment to segment transition sees only one repeater delay and is multiple master capable on each segment. Using multiple PCA9518 parts, any width hub (in multiples of five)1 can be implemented using the expansion pins. The PCA9518 is a wider voltage range (2.3 V to 3.6 V) version of the PCA9518 and also improves partial power-down performance, keeping I2C-bus I/O pins in high-impedance state when VDD is below 2.0 V. A PCA9518 cluster cannot be put in series with a PCA9515/16 or with another PCA9518 cluster. Multiple PCA9518 devices can be grouped with other PCA9518 devices into any size cluster thanks to the EXPxxxn pins that allow the I2C-bus signals to be sent/received from/to one PCA9518 to/from another PCA9518 within the cluster. Since there is no direction pin, slightly different `legal' low voltage levels are used to avoid lock-up conditions between the input and the output of individual repeaters in the cluster. A `regular LOW' applied at the input of any of the PCA9518 devices will then be propagated as a `buffered LOW' with a slightly higher value to all enabled outputs in the PCA9518 cluster. When this `buffered LOW' is applied to a PCA9515 and PCA9516 or separate PCA9518 cluster (not connected via the EXPxxxn pins) in series, the second PCA9515 and PCA9516 or PCA9518 cluster will not recognize it as a `regular LOW' and will not propagate it as a `buffered LOW' again. The PCA9510/9511/9513/9514 and PCA9512 cannot be used in series with the PCA9515 and PCA9516 or PCA9518, but can be used in series with themselves since they use shifting instead of static offsets to avoid lock-up conditions.
1.
Only four ports per device are available if individual Enable is required.
NXP Semiconductors
PCA9518
Expandable 5-channel I2C-bus hub
2. Features
I I I I I I I I I I I I Expandable 5 channel, bidirectional buffer I2C-bus and SMBus compatible Active HIGH individual repeater enable inputs Open-drain input/outputs Lock-up free operation Supports arbitration and clock stretching across the repeater Accommodates Standard-mode and Fast-mode I2C-bus devices and multiple masters Powered-off high-impedance I2C-bus pins Operating supply voltage range of 3.0 V to 3.6 V 5 V tolerant I2C-bus and enable pins 0 Hz to 400 kHz clock frequency2 ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA I Package offerings: SO20 and TSSOP20
3. Ordering information
Table 1. Ordering information Tamb = -40 C to +85 C Type number PCA9518D PCA9518PW Topside mark Package Name PCA9518D PCA9518 SO20 TSSOP20 Description plastic small outline package; 20 leads; body width 7.5 mm plastic thin shrink small outline package; 20 leads; body width 4.4 mm Version SOT163-1 SOT360-1
2.
The maximum system operating frequency may be less than 400 kHz because of the delays added by the repeater.
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PCA9518_5
Product data sheet
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PCA9518
Expandable 5-channel I2C-bus hub
4. Block diagram
VCC
EXPSCL1 EXPSCL2 BUFFER BUFFER SCL1 BUFFER HUB LOGIC BUFFER SCL2 BUFFER
PCA9518
SCL0
SCL4
SCL3
EXPSDA1 EXPSDA2 BUFFER BUFFER SDA1 BUFFER HUB LOGIC BUFFER SDA2 BUFFER SDA3 SDA4
SDA0
EN1 EN2
002aae325
EN4 EN3
GND
Fig 1.
Block diagram of PCA9518
A more detailed view of Figure 1 buffer is shown in Figure 2.
data
to output
in inc enable
002aac531
Fig 2.
Buffer detail
The output pull-down voltage of each internal buffer is set for approximately 0.5 V, while the input threshold of each internal buffer is set about 0.07 V lower, when the output is internally driven LOW. This prevents a lock-up condition from occurring.
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PCA9518
Expandable 5-channel I2C-bus hub
5. Pinning information
5.1 Pinning
EXPSCL1 EXPSCL2 SCL0 SDA0 SCL1 SDA1 EN1 SCL2 SDA2
1 2 3 4 5 6 7 8 9
20 VCC 19 EXPSDA2 18 EXPSDA1 17 EN4 16 SDA4 15 SCL4 14 EN3 13 SDA3 12 SCL3 11 EN2
002aac739
EXPSCL1 1 EXPSCL2 2 SCL0 3 SDA0 4 SCL1 5 SDA1 6 EN1 7 SCL2 8 SDA2 9 GND 10
002aac740
20 VCC 19 EXPSDA2 18 EXPSDA1 17 EN4 16 SDA4 15 SCL4 14 EN3 13 SDA3 12 SCL3 11 EN2
PCA9518D
PCA9518PW
GND 10
Fig 3.
Pin configuration for SO20
Fig 4.
Pin configuration for TSSOP20
5.2 Pin description
Table 2. Symbol EXPSCL1 EXPSCL2 SCL0 SDA0 SCL1 SDA1 EN1 SCL2 SDA2 GND EN2 SCL3 SDA3 EN3 SCL4 SDA4 EN4 EXPSDA1 EXPSDA2 VCC Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Description expandable serial clock pin 1 expandable serial clock pin 2 serial clock bus 0 serial data bus 0 serial clock bus 1 serial data bus 1 active HIGH bus 1 enable input serial clock bus 2 serial data bus 2 supply ground active HIGH bus 2 enable input serial clock bus 3 serial data bus 3 active HIGH bus 3 enable input serial clock bus 4 serial data bus 4 active HIGH bus 4 enable input expandable serial data pin 1 expandable serial data pin 2 supply voltage
PCA9518_5
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Product data sheet
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PCA9518
Expandable 5-channel I2C-bus hub
6. Functional description
The PCA9518 BiCMOS integrated circuit is a five-way hub repeater, which enables I2C-bus and similar bus systems to be expanded in increments of five with only one repeater delay and no functional degradation of system performance. The PCA9518 BiCMOS integrated circuit contains five multi-directional, open-drain buffers specifically designed to support the standard low-level contention arbitration of the I2C-bus. Except during arbitration or clock stretching, the PCA9518 acts like a pair of non-inverting, open-drain buffers, one for SDA and one for SCL. Refer to Figure 1 "Block diagram of PCA9518".
6.1 Enable
The enable pins EN1 through EN4 are active HIGH and have internal pull-up resistors. Each enable pin ENn controls its associated SDAn and SCLn ports. When LOW, the ENn pin blocks the inputs from SDAn and SCLn, as well as disabling the output drivers on the SDAn and SCLn pins. The enable pins should only change state when both the global bus and the local port are in an idle state to prevent system failures. The active HIGH enable pins allow the use of open-drain drivers which can be wire-ORed to create a distributed enable where either centralized control signal (master) or spoke signal (sub-master) can enable the channel when it is idle. Unused channels must have pull-up resistors unless their enable pin (ENn) is always LOW. Port 0 must always have pull-up resistors since it is always present in the bus and cannot be disabled.
6.2 Expansion
The PCA9518 includes 4 open-drain I/O pins used for expansion. Two expansion pins, EXPSDA1 and EXPSDA2 are used to communicate the internal state of the serial data within each hub to the other hubs. The EXPSDA1 pins of all hubs are connected together to form an open-drain bus. Similarly, all EXPSDA2 pins, EXPSCL1 pins, and all EXPSCL2 pins are connected together forming a 4-wire bus between hubs. When it is necessary to be able to deselect every port, each expansion device only contributes 4 ports which can be enabled or disables because the fifth does not have an enable pin. Pull-up resistors are required on the EXPxxxn3 pins even if only one PCA9518 is used.
6.3 I2C-bus systems
As with the standard I2C-bus system, pull-up resistors are required to provide the logic HIGH levels on the buffered bus. (Standard open-collector or open-drain configuration of the I2C-bus). The size of these pull-up resistors depends on the system, but each side of the repeater must have a pull-up resistor. This part is designed to work with Standard-mode (0 Hz to 100 kHz) and Fast-mode (0 Hz to 400 kHz) I2C-bus devices in addition to SMBus devices. Standard-mode I2C-bus devices only specify 3 mA output drive; this limits the termination current to 3 mA in a generic I2C-bus system where
3. `xxxn' is SDA1, SDA2, SCL1 or SCL2. `xxx' is SDA or SCL.
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PCA9518_5
Product data sheet
Rev. 05 -- 2 December 2008
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PCA9518
Expandable 5-channel I2C-bus hub
Standard-mode devices and multiple masters are possible. Please see application note AN255, I2C/SMBus Repeaters, Hubs and Expanders for additional information on sizing resistors.
7. Application design-in information
A typical application is shown in Figure 5. In this example, the system master is running on a 3.3 V I2C-bus while the slaves are connected to a 3.3 V or 5 V bus. All buses run at 100 kHz unless slave 3, slave 4 and slave 5 are isolated from the bus. Then the master bus and slave 1, slave 2 and slave 6 can run at 400 kHz. Any segment of the hub can talk to any other segment of the hub. Bus masters and slaves can be located on any segment with 400 pF load allowed on each segment. The PCA9518 is 5 V tolerant, so it does not require any additional circuitry to translate between the different bus voltages. When one port of the PCA9518 is pulled LOW by a device on the I2C-bus, a CMOS hysteresis type input detects the falling edge and drives the EXPxxx1 line LOW, when the EXPxxx1 voltage is less than 0.5VCC, the other ports are pulled down to the VOL of the PCA9518 which is typically 0.5 V. In order to illustrate what would be seen in a typical application, refer to Figure 6. If the bus master in Figure 5 were to write to the slave through the PCA9518, we would see the waveform shown in Figure 6. This looks like a normal I2C-bus transmission except for the small foot preceding each clock LOW-to-HIGH transition and proceeding each data LOW-to-HIGH transition for the master. The foot height is the difference between the LOW level driven by the master and the higher voltage LOW level driven by the PCA9518 repeater. Its width corresponds to an effective clock stretching coming from the PCA9518 that delays the rising edge of the clock. That same magnitude of delay is seen on the rising edge of the data. The foot on the rising edge of the data is extended through the 9th clock pulse as the PCA9518 repeats the acknowledge from the slave to the master. The clock of the slave looks normal except the VOL is the ~0.5 V level generated by the PCA9518. The SDA at the slave has a particularly interesting shape during the 9th clock cycle where the slave pulls the line below the value driven by the PCA9518 during the acknowledge and then returns to the PCA9518 level creating a foot before it completes the LOW-to-HIGH transition. SDA lines other than the one with the master and the one with the slave have a uniform LOW level driven by the PCA9518 repeater. The other four waveforms are the expansion bus signals and are included primarily for timing reference points. All timing on the expansion bus is with respect to 0.5VCC. EXPSDA1 is the expansion bus that is driven LOW whenever any SDA pin falls below 0.3VCC. EXPSDA2 is the expansion bus that is driven LOW whenever any pin is 0.4 V. EXPSCL1 is the expansion bus that is driven LOW whenever any SCL pin falls below 0.3VCC. EXPSCL2 is the expansion bus that is driven LOW whenever any SCL pin is 0.4 V. The EXPSDA2 returns HIGH after the SDA pin that was the last one being held below 0.4 V by an external driver starts to rise. The last SDA to rise above 0.4 V is held down by the PCA9518 to ~0.5 V until after the delay of the circuit which determines that it was the last to rise, then it is allowed to rise above the ~0.5 V level driven by the PCA9518. Considering the bus 0 SDA to be the last one to go above 0.4 V, then the EXPSDA1 returns to HIGH after the EXPSDA2 is HIGH and either the bus 0 SDA rise time
PCA9518_5
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Product data sheet
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PCA9518
Expandable 5-channel I2C-bus hub
is 1 s or, when the bus 0 SDA reaches 0.7VCC, whichever occurs first. After both EXPSDA2 and EXPSDA1 are HIGH the rest of the SDA lines are allowed to rise. The same description applies for the EXPSCL1, EXPSCL2, and SCL pins.
5V
3.3 V
5V
VCC SDA SCL SUBSYSTEM 5 100 kHz 3.3 V EXPSCL2 SDA1 SCL1 EXPSDA1 EXPSDA2 EXPSCL1
VCC EXPSDA1 EXPSDA2 EXPSCL1 3.3 V EXPSCL2 SDA1 SCL1 SDA SCL SUBSYSTEM 1 400 kHz
SDA SCL SUBSYSTEM 6 400 kHz
SDA2 SCL2 3.3 V or 5 V SDA0 SCL0 SDA SCL SDA0 SCL0
SDA2 SCL2
SDA SCL SUBSYSTEM 2 400 kHz 5V
PCA9518
DEVICE 2 BUS MASTER 400 kHz EN1 EN2 EN3 EN4 SDA4 SCL4 GND
PCA9518
DEVICE 1
SDA3 SCL3 3.3 V or 5 V
SDA3 SCL3 EN1 EN2 EN3 EN4 SDA4 SCL4 GND 3.3 V
SDA SCL SUBSYSTEM 3 100 kHz
disabled; not connected
SDA SCL SUBSYSTEM 4 100 kHz
002aae326
Only two of the five channels on the PCA9518 Device 2 are being used. EN3 and EN4 are connected to GND to disable channels 3 and 4 and/or SDA3/SCL3 and SDA4/SCL4 are pulled up to VCC. SDA0 and SCL0 can be used as a normal I2C-bus port, but if unused then it must be pulled up to VCC since there is no enable pin. The pull-ups shown on Device 2 channels 3 and 4 are not required if their enable pins (ENn) are permanently held LOW.
Fig 5.
Typical application: multiple expandable 5-channel I2C-bus hubs
PCA9518_5
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PCA9518
Expandable 5-channel I2C-bus hub
VOL of master SCL of master Bus 0 SDA of master tPHL1 EXPSDA1 tPLH1 tPHL2 EXPSDA2 expansion bus EXPSCL1
9th clock cycle
VOL of PCA9518
9th clock cycle
tstretch
tPLH2, tPLH1 tPLH2
EXPSCL2
SCL of slave Bus 1 SDA of slave tPHL Bus n with n > 1
002aae327
VOL of slave
VOL of PCA9518
tPLH
Fig 6.
Bus waveforms
It is important to note that any arbitration or clock stretching events on Bus 1 require that the VOL of the devices on Bus 1 be 70 mV below the VOL of the PCA9518 (see VOL-VILc in Section 9 "Static characteristics") to be recognized by the PCA9518 and then transmitted to Bus 0.
PCA9518_5
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Expandable 5-channel I2C-bus hub
8. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI2C-bus II Ptot Tstg Tamb
[1]
Parameter supply voltage I2C-bus voltage input current total power dissipation storage temperature ambient temperature
Conditions VCC to GND SCL or SDA any pin
[1] [1]
Min -0.5 -0.5 -55
Max +7 +7 50 300 +125 +85
Unit V V mA mW C C
operating
-40
Voltages with respect to pin GND.
PCA9518_5
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Expandable 5-channel I2C-bus hub
9. Static characteristics
Table 4. Static characteristics VCC = 3.0 V to 3.6 V; GND = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. Symbol Supplies VCC ICCH supply voltage HIGH-level supply current both channels HIGH VCC = 3.6 V; SDAn = SCLn = VCC ICCL LOW-level supply current both channels LOW VCC = 3.6 V; one SDA and one SCL = GND; other SDA and SCL open ICCLc contention LOW-level supply current HIGH-level input voltage LOW-level input voltage input clamping voltage input leakage current LOW-level input current LOW-level output voltage VDD = 3.6 V; SDAn = SCLn = VSS 9 11 mA 9 11 mA 3.0 3.3 7.5 3.6 10 V mA Parameter Conditions Min Typ Max Unit
Input SCL; input/output SDA VIH VIL VILc VIK ILI IIL VOL VOL-VILc SCL, SDA SCL, SDA II = -18 mA VI = 3.6 V SCL, SDA; VI = 0.2 V SCL, SDA; IOL = 0 mA[3] or 6 mA
[1] [2]
0.7VCC -0.5 -0.5 0.47 -
0.52 -
5.5 +0.3VCC +0.4 -1.2 1 20 0.6 70
V V V V A A V mV
contention LOW-level input voltage SCL, SDA
difference between LOW-level guaranteed by design output and LOW-level input voltage contention input capacitance LOW-level input voltage HIGH-level input voltage LOW-level input current input leakage current input capacitance HIGH-level input voltage LOW-level input voltage LOW-level input current LOW-level output voltage input capacitance VI = 3.0 V or 0 V EXPxxxn EXPxxxn EXPxxxn; VI = 0.2 V EXPxxxn; IOL = 12 mA VI = 3.0 V or 0 V VI = 0.2 V; EN1 to EN4 VI = 3 V or 0 V
Ci VIL VIH IIL ILI Ci VIH VIL IIL VOL Ci
[1] [2] [3]
-0.5 2.0 -1 -
6 10 3
8 +0.8 5.5 30 +1 7 5.5 5 0.5 8
pF V V A A pF V A V pF
Enable 1 to Enable 4 (EN1 to EN4)
Expansion pins (EXPSCL1, EXPSCL2, EXPSDA1, EXPSDA2) 0.55VCC -0.5 6 +0.45VCC V
VIL specification is for the first LOW level seen by the SDAn/SCLn lines. VILc is for the second and subsequent LOW levels seen by the SDAn/SCLn lines. Test performed with IOL = 10 A.
PCA9518_5
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Expandable 5-channel I2C-bus hub
10. Dynamic characteristics
Table 5. Symbol tPHL tPLH tPHL1 tPLH1 tPLH2 tTHL tTLH tsu th
[1]
Dynamic characteristics Parameter HIGH to LOW propagation delay LOW to HIGH propagation delay HIGH to LOW propagation delay 1 LOW to HIGH propagation delay 1 LOW to HIGH propagation delay 2 HIGH to LOW output transition time LOW to HIGH output transition time set-up time hold time Conditions SDA to SDAn, or SCL to SCLn; Figure 7 SDA to SDAn, or SCL to SCLn; Figure 7 EXPSDA1 to SDA, or EXPSCL1 to SCL; Figure 7 EXPSDA1 to SDA, or EXPSCL1 to SCL; Figure 7 EXPSDA2 to SDA, or EXPSCL2 to SCL; Figure 7 SDA, SCL; Figure 7 SDA, SCL; Figure 7 enable to START condition enable after STOP condition
[1][2]
Min 105 110 109 130 160 58 300 300
Typ 202 259 193 153 234 110 0.85 RC -
Max 389 265 327 179 279 187 -
Unit ns ns ns ns ns ns ns ns ns
[1][3]
The SDA and SCL propagation delays are dominated by rise times or fall times. The fall times are mostly internally controlled and are only sensitive to load capacitance. The rise times are RC time constant controlled and therefore a specific numerical value can only be given for fixed RC time constants. The SDA HIGH to LOW propagation delay includes the fall time from VCC to 0.5VCC of the EXPSDA1 or EXPSCL1 pins and the SDA or SCL fall time from the quiescent HIGH (usually VCC) to below 0.3VCC. The SDA and SCL outputs have edge rate control circuits included which make the fall time almost independent of load capacitance. The SDA or SCL LOW to HIGH propagation delay includes the rise time constant from the quiescent LOW to 0.5VCC for the EXPSDA1 or EXPSCL2, the rise time constant for the quiescent LOW to 0.5VCC for the EXPSDA1 or EXPSCL1, and the rise time constant from the quiescent external driven LOW to 0.7VCC for the SDA or SCL output. All of these rise times are RC time constants determined by the external resistance and total capacitance for the various nodes.
[2]
[3]
tTHL input SDA or SCL 0.7VCC 0.3VCC 0.4 V tPHL tPHL1 EXPSDA1 or EXPSCL1 0.5VCC tPHL2 0.5VCC tPLH2 0.3VCC 0.4 V effective stretch
tTLH 0.7VCC
EXPSDA2 or EXPSCL2 tPHL1
0.5VCC
0.5VCC
tPLH tPLH1 tPLH2 tTLH 0.7VCC
tTHL 0.7VCC output SDA or SCL 0.52 V 0.3VCC
0.3VCC
002aae328
Fig 7.
PCA9518_5
AC waveforms
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Expandable 5-channel I2C-bus hub
11. Test information
VCC VCC
RL
PULSE GENERATOR
VI DUT
RT
VO
CL
002aad479
RL = load resistor; 1.1 k for I2C-bus, and 500 for EXPxxxn. CL = load capacitance includes jig and probe capacitance; 100 pF for I2C-bus, and 100 pF for EXPxxxn. RT = termination resistance should be equal to Zo of the pulse generators.
Fig 8.
Test circuit for open-drain outputs
PCA9518_5
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12. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 9.
PCA9518_5
Package outline SOT163-1 (SO20)
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PCA9518
Expandable 5-channel I2C-bus hub
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
E
A
X
c y HE vMA
Z
20
11
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
10
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 6.6 6.4 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
Fig 10. Package outline SOT360-1 (TSSOP20)
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13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
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Expandable 5-channel I2C-bus hub
13.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 11) than a SnPb process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 6 and 7
Table 6. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 7. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 11.
PCA9518_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 2 December 2008
16 of 21
NXP Semiconductors
PCA9518
Expandable 5-channel I2C-bus hub
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
14. Abbreviations
Table 8. Acronym CDM BiCMOS DUT ESD HBM I/O I2C-bus MM RC SMBus Abbreviations Description Charged-Device Model Bipolar Complementary Metal-Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Input/Output Inter-Integrated Circuit bus Machine Model Resistor Capacitor network System Management Bus
PCA9518_5
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Product data sheet
Rev. 05 -- 2 December 2008
17 of 21
NXP Semiconductors
PCA9518
Expandable 5-channel I2C-bus hub
15. Revision history
Table 9. Revision history Release date 20081202 Data sheet status Product data sheet Change notice Supersedes PCA9518_4 Document ID PCA9518_5 Modifications:
* * * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Section 6.1 "Enable": added new 3rd paragraph Figure 5 "Typical application: multiple expandable 5-channel I2C-bus hubs": added 2nd paragraph below drawing. Figure 6 "Bus waveforms": - changed symbol from "tst" to "tstretch" - changed symbol from "tr1" to "tPHL1" - changed symbol from "tr2" to "tPHL2" - changed symbol from "tEr1" to "tPLH2, tPLH1"
*
Table 3 "Limiting values": - changed symbol/parameter from "VCC to GND, supply voltage range VCC" to "VCC, supply voltage" (and placed "VCC to GND" in Conditions column) - changed symbol/parameter from "Vbus, voltage range I2C-bus, SCL or SDA" to "VI2C-bus, I2C-bus voltage" (and placed "SCL or SDA" in Conditions column) - changed symbol/parameter from "I, DC current (any pin)" to "II, input current" (and placed "any pin" in Conditions column) - changed parameter for Ptot from "power dissipation" to "total power dissipation"
*
Table 4 "Static characteristics": - sub-section "Supplies"; symbol ICCH: changed parameter from "quiescent supply current, both channels HIGH" to "HIGH-level supply current"; moved "both channels HIGH" to Conditions column - sub-section "Supplies"; symbol ICCL: changed parameter from "quiescent supply current, both channels LOW" to "LOW-level supply current"; moved "both channels LOW" to Conditions column - sub-section "Supplies"; symbol ICCLc: changed parameter from "quiescent supply current in contention" to "contention LOW-level supply current" - sub-section "Input SCL; input/output SDA", symbol used for parameter "input leakage current" changed from "II" to "ILI" - sub-section "Input SCL; input/output SDA", symbol VOL-VILc: parameter changed from "LOW level input voltage below output LOW level voltage" to "difference between LOW-level output and LOW-level input voltage contention" - (old) table note 1 is split into (new) Table note [1] and Table note [2]
PCA9518_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 2 December 2008
18 of 21
NXP Semiconductors
PCA9518
Expandable 5-channel I2C-bus hub
Table 9.
Revision history ...continued Release date Data sheet status Change notice Supersedes
Document ID Modifications: (continued)
*
Table 5 "Dynamic characteristics": - symbol/parameter "tPHLs, Propagation delay SDA to SDAn or SCL to SCLn" changed to "tPHL, HIGH to LOW propagation delay" (moved "SDA to SDAn or SCL to SCLn" to Conditions column) - symbol/parameter "tPLHs, Propagation delay SDA to SDAn or SCL to SCLn" changed to "tPLH, HIGH to LOW propagation delay" (moved "SDA to SDAn or SCL to SCLn" to Conditions column) - symbol/parameter "tPHLE1s, Propagation delay EXPSDA1 to SDA or EXPSCL1 to SCL" changed to "tPHL1, HIGH to LOW propagation delay 1" (moved "EXPSDA1 to SDA or EXPSCL1 to SCL" to Conditions column) - symbol/parameter "tPLHE1s, Propagation delay EXPSDA1 to SDA or EXPSCL1 to SCL" changed to "tPLH1, LOW to HIGH propagation delay 1" (moved "EXPSDA1 to SDA or EXPSCL1 to SCL" to Conditions column) - symbol/parameter "tPLHE2s, Propagation delay EXPSDA2 to SDA or EXPSCL2 to SCL" changed to "tPLH2, LOW to HIGH propagation delay 2" (moved "EXPSDA2 to SDA or EXPSCL2 to SCL" to Conditions column) - symbol/parameter "tTHLs, Transition time, SDA/SCL" changed to "tTHL, HIGH to LOW transition time" (moved "SDA, SCL" to Conditions column) - symbol/parameter "tTLHs, Transition time, SDA/SCL" changed to "tTLH, LOW to HIGH transition time" (moved "SDA, SCL" to Conditions column) - symbol/parameter "tSET, Enable to Start condition" changed to "tsu, set-up time" (moved "enable to START condition" to Conditions column) - symbol/parameter "tHOLD, Enable after Stop condition" changed to "th, hold time" (moved "enable to START condition" to Conditions column)
*
Figure 7 "AC waveforms": timing symbols updated as per symbol/parameter changes detailed above for Table 5 "Dynamic characteristics" Product data sheet Product data sheet Product data Product data PCA9518_3 PCA9518_2
PCA9518_4 20040929 (9397 750 14109) PCA9518_3 20040624 (9397 750 13253) PCA9518_2 20031110 (9397 750 12295) PCA9518_1 20020820 (9397 750 10258)
ECN 853-2364 30410 PCA9518_1 dated 2003 Oct 03 ECN 853-2364 28791 dated 2002 Aug 20
PCA9518_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 2 December 2008
19 of 21
NXP Semiconductors
PCA9518
Expandable 5-channel I2C-bus hub
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus -- logo is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9518_5
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 -- 2 December 2008
20 of 21
NXP Semiconductors
PCA9518
Expandable 5-channel I2C-bus hub
18. Contents
1 2 3 4 5 5.1 5.2 6 6.1 6.2 6.3 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Enable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Expansion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 I2C-bus systems . . . . . . . . . . . . . . . . . . . . . . . . 5 Application design-in information . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Static characteristics. . . . . . . . . . . . . . . . . . . . 10 Dynamic characteristics . . . . . . . . . . . . . . . . . 11 Test information . . . . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering of SMD packages . . . . . . . . . . . . . . 15 Introduction to soldering . . . . . . . . . . . . . . . . . 15 Wave and reflow soldering . . . . . . . . . . . . . . . 15 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 December 2008 Document identifier: PCA9518_5

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